Some Galaxy S27 and S27 Plus models are expected to be powered by Samsung's own Exynos 2700 processor. This chipset has been the subject of early rumors, but a new report suggests the processor could undergo a concerning change that may affect its thermal performance.

The Exynos 2700 could ditch Fan-Out Wafer-Level Packaging (FOWLP). Samsung is reportedly considering abandoning this advanced manufacturing process because it is costly and can affect yield rates. FOWLP was first used on the Exynos 2400, where Samsung claimed it enabled a 23% improvement in heat resistance when running on a single core and an 8% improvement for multi-core tasks. Removing this packaging could lead to higher operating temperatures.

However, Samsung is not leaving thermal management entirely unaddressed. The Exynos 2600, expected in some Galaxy S26 and S26 Plus variants, introduced a heat-path block (HPB) that acts as a heat sink to reduce heating. The Exynos 2700 is expected to build on this by placing the DRAM next to the processor rather than on top of the chip. This side-by-side approach should allow the HPB to cover both the memory and processor, improving cooling in the process.

Background on Exynos Chip Packaging

Samsung's Exynos series has a long history of engineering trade-offs. The Exynos 990, used in the Galaxy S20 series, faced criticism for overheating and performance throttling. In response, Samsung invested heavily in packaging technologies like FOWLP for the Exynos 2400. FOWLP not only improves thermal dissipation but also reduces the thickness of the chip package and improves signal integrity. The decision to potentially drop it for the Exynos 2700 suggests that the cost savings and yield improvements outweigh the thermal benefits in Samsung's view.

The industry source quoted in the report stated, "While applying WLP to flagship Exynos chips was effective in terms of performance and thermal management, it did not generate much profit because the packaging itself became very complex and the yield risk was high. If the volume were large, profitability could be covered to some extent, but currently, since it is only being applied to a portion of the MX business unit's own models, the cost burden is bound to be heavy." This highlights the business pressure Samsung faces in balancing innovation with profitability.

Cooling Innovations to Offset FOWLP Removal

The heat-path block (HPB) is a relatively new addition to Exynos chips. It works by providing a direct thermal path from the chip's hot spots to the phone's chassis or heat sink. In the Exynos 2600, this feature showed promising results in internal tests. For the Exynos 2700, Samsung engineers have gone a step further by relocating the DRAM from a stacked configuration to a side-by-side arrangement. Traditionally, RAM is stacked on top of the processor, which can trap heat. With side-by-side placement, both components can be covered by a single HPB, allowing more efficient heat spreading.

Additionally, Samsung is likely to use advanced thermal interface materials (TIMs) and vapor chambers in the Galaxy S27 series. Vapor chambers are widely used in flagship phones to move heat away from the processor. Combined with the HPB, these measures could potentially compensate for the loss of FOWLP. However, it remains to be seen whether the cumulative effect will match the thermal performance that FOWLP provided.

Historical Context: Exynos Thermal Challenges

Samsung's Exynos chips have historically struggled with thermal management. The Exynos 2100 in the Galaxy S21 series was a significant improvement, but the Exynos 2200 in the Galaxy S22 series introduced AMD RDNA2 graphics, which led to higher power consumption and heat generation. The Exynos 2200 was widely criticized for throttling under sustained loads. The Exynos 2400 addressed these issues with FOWLP and a refined architecture, earning praise for better performance and efficiency.

Given this history, the potential removal of FOWLP from the Exynos 2700 raises red flags. However, the side-by-side DRAM placement and HPB could represent a new generation of thermal solutions. Samsung's foundry division is also expected to adopt gate-all-around (GAA) transistor technology for the Exynos 2700, which could improve power efficiency and reduce heat generation at the transistor level. GAA transistors offer better control over leakage current, which is a major source of heat in advanced nodes.

What This Means for Galaxy S27 Users

For consumers, the key takeaway is that Galaxy S27 models powered by the Exynos 2700 may run hotter than their predecessors, but they might also incorporate more sophisticated cooling hardware. The final experience will depend on how software throttle thresholds are set and how real-world workloads behave. Heavy gaming and sustained video recording could push the chip to its limits, potentially causing noticeable warmth. Samsung's thermal design power (TDP) targets and chassis design will play a crucial role.

Moreover, not all Galaxy S27 models will use Exynos chips. Samsung typically splits its flagship line between Exynos and Qualcomm Snapdragon processors depending on the region. In markets like the US and China, Snapdragon chips are more common, while Exynos dominates in Europe and parts of Asia. Users in Exynos regions should pay close attention to early reviews of the Galaxy S27 series to see if thermal performance is acceptable.

Competitive Landscape

Samsung is not alone in facing packaging challenges. TSMC has pioneered advanced packaging like InFO (Integrated Fan-Out) and CoWoS (Chip-on-Wafer-on-Substrate), which are used by Apple's A-series and M-series chips. Samsung's decision to retreat from FOWLP might put it at a disadvantage in terms of thermal density for performance. However, Samsung's own foundry is working on new packaging technologies like X-Cube (3D stacking) and I-Cube (2.5D), but these are not yet mature for mass production in the Exynos line.

Qualcomm's Snapdragon chips, fabricated by TSMC, have generally been more power-efficient and cooler than equivalent Exynos chips in recent years. This has led to a perception gap, with many users preferring Snapdragon variants. If the Exynos 2700 runs hot, it could widen that gap, especially if Samsung's other cooling measures are insufficient.

On the other hand, Apple's A18 and M4 chips use advanced packaging from TSMC and have set high standards for performance per watt. Samsung needs to close that gap to remain competitive in the premium segment. The Exynos 2700's thermal strategy will be a critical factor in that effort.

Ultimately, the decision to drop FOWLP is a calculated risk. Samsung must believe that the cost savings and yield improvements will allow it to ship more chips at lower prices, or invest those savings elsewhere. The addition of HPB and side-by-side DRAM suggests they are aware of the thermal implications and are working around them. However, only real-world testing will confirm whether these changes are enough.

As the launch of the Galaxy S27 series approaches, more details will emerge. For now, users should keep an eye on benchmark and thermal tests from reputable sources. The Exynos 2700 could be a capable chip that runs acceptably cool, or it could revive the overheating complaints of past Exynos generations. Samsung's reputation in the mobile processor space hangs in the balance.

Source: Android Authority News